GSMM 2019 Global Symposium on Millimeter Waves 2019 May 22-24, 2019 | Sendai, Japan

LATEST NEWS

  • 2019/03/18Registration page open
  • 2019/03/06Entry Visa to Japan page open
  • 2019/03/01Keynote's abstract update
  • 2018/12/25GSMM 2019 website open

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About GSMM 2019

The main theme of the GSMM2019 is Millimeter-wave Propagation: Hardware, Measurements and Systems. It covers millimeter-wave and THz devices, circuits, systems, and applications. The conference will include keynote talks, technical sessions and poster sessions on the listed topics. This conference will be sponsored by Research Institute of Electrical Communication (RIEC), Tohoku University and technically sponsored by IEEE MTT-S, IEEE MTT-S Japan Chapter, IEEE AP-S Tokyo Chapter, and Technical Committee on Microwaves / Technical Committee on Radio Communication Systems of IEICE. As you may know, Sendai is one of the historic sites for microwave & antenna engineering and is the birthplace of Yagi-Uda antenna. Please enjoy the atmosphere of Sendai.

Sendai is one of the largest cities in the northern part of Japan and has a mild climate, 400 years of tradition as well as a harmonious combination of beautiful nature and urban facilities. Tohoku University is well known as the birthplace of Yagi-Uda antenna, and complementary antenna in the area of antenna researches.

CONFERENCE DATE

  • May 22th–24th, 2019.

VENUE

  • Katahira Sakura Hall, Sendai, Japan

IMPORTANT DATE

  • Registration of paper submission deadline: Feb. 8th, 2019. (Extended)
    00:00:59 JST
  • Acceptance Notification: Mar. 7th, 2019.
  • Camera-ready paper submission deadline: Mar. 22th, 2019.
  • Visa document request deadline: Apr. 19th, 2019.
  • Rump session registration deadline: May 2nd, 2019.
  • Participant registration deadline: May 14th, 2019.
  • Registration fee payment deadline: May 14th, 2019.

Technical Areas

Millimeter-Wave Antennas and Passive Devices
Antennas and Propagation
Waveguides and Transmission Lines
Filters
Multiple-Element Antenna Arrays
Materials, Substrates, and Packaging
Millimeter-Wave and THz Communications
5G Wireless Communications
Wireless Channel Measurements and Modeling
Over-the-Air (OTA) Test Methods
Wireless LANs and PANs
Backhaul for 4G/5G Small Cells
Satellite Communications
Millimeter-Wave and THz Sensing
Instruments for Radio Astronomy
Radar, Remote Sensing, and Imaging
Systems and Subsystems
Sub-Millimeter-Wave and THz Technologies
Devices and Systems
Photonic Devices and Systems
Integration Technologies
Millimeter-Wave Active Devices and ICs
Devices: MMICs, PAs, LNAs, Mixers, Multipliers, VCOs
Technologies: HEMT, CMOS, HBT, GaN, SiGe, Schottky, HBV
On-Wafer and Advanced Measurements
Emerging Technologies and Applications
Internet-of-Things (IoT) and Machine-to-Machine (M2M)
Biomedical Applications
Wireless Power Transfer (WPT)
Nano-Electronic Devices
Automotive and Industrial Applications
New Materials